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| Adhesives, Films & Preforms |
| Adhesives, films and preforms are available in the following classifications:
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| The following is an abbreviated, general selector guide to illustrate a variety of available materials. There a numerous other formulations available to meet your needs, but space precludes listing them. |
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| Contact us via Email or through the "Customer Request" link for personal assistance in selecting the appropriate material and process for your application. |
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Thermally Conductive |
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EMI, RFI Shielding |
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TC1 |
TC2 |
TC3 |
TC4 |
EMI1 |
EMI2 |
EMI3 |
| Working Life |
7 days @ 20°C |
30 days @ 20°C |
7 days @ 20°C |
30 days @ 20°C |
7 days @ 20°C |
7 days @ 20°C |
30 days @ 20°C |
| Shelf Life |
12 months @ -40°C |
12 months @ -40°C |
12 months @ -40°C |
12 months @ -40°C |
12 months @ -40°C |
12 months @ -40°C |
6 months @ -10°C |
| Color |
Cream |
Gray |
Cream |
Cream |
Silver |
Silver |
Silver |
| Thermal Conductivity |
0.45 W/mK |
0.45 W/mK |
0.40 W/mK |
0.45 W/mK |
----- |
----- |
----- |
| Lap Shear Strength (psi) |
2,800 |
1,900 |
3,800 |
1,850 |
1,250 |
1,500 |
>1,300 |
| Cure |
60 minutes @ 150°C |
60 minutes @ 150°C |
60 minutes @ 130°C |
15 minutes @ 140°C |
60 minutes @ 150°C |
15 minutes @ 150°C+ |
60 minutes @ 150°C |
| T(g) (%) |
112°C |
130°C |
93°C |
205°C |
106°C |
>160°C |
>130°C |
| Linear CTE |
42x10-6 |
47x10-6 |
TBD |
46x10-6 |
57x10-6 |
55x10-6 |
TBD |
| Volume Resistivity |
N/A |
N/A |
N/A |
----- |
1.0x10-4 |
2.0x10-3 |
2.0x10-2 |
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| Very high bond strength |
X |
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| Highest T(C) |
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X |
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| Highest chemical resistance |
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|
X |
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| Highest T(g) |
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|
X |
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| Good chemical & thermal resistance |
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X |
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| High temperature applications |
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X |
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| Medium to high temperature applications |
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X |
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| Notes: |
1 |
2 |
3 |
4 |
5, 6 |
5, 7 |
5, 8 |
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---- Top ---- |
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| Notes: |
| 1. Adhesive for gold, Invar, & hard-to-bond substrates |
| 2. Highest T(C), Good chemical resistance |
| 3. Low temperature cure, Highly chemical resistant |
| 4. High T(c), Electrically insulative |
| 5. Electrically conductive film |
| 6. Mil Std. 883, Method 5011 |
| 7. Higher temperature applications |
| 8. General purpose applications |
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Electrically Conductive |
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Structural Adhesives |
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EC1 |
EC2 |
EC3 |
SA1 |
SA2 |
SA3 |
| Working Life |
30 days @ 20°C |
7 days @ 20°C |
30 days @ 20°C |
14 days @ 20°C |
30 days @ 20°C |
3 days @ 20°C |
| Shelf Life |
12 months @ -40°C |
12 months @ -40°C |
12 months @ -40°C |
12 months @ -40°C |
12 months @ -40°C |
12 months @ -40°C |
| Color |
Silver |
Silver |
Silver |
Amber |
Amber |
Translucent |
| Thermal Conductivity |
----- |
----- |
----- |
----- |
----- |
----- |
| Lap Shear Strength (psi) |
2,000 |
1,250 |
1,500 |
4,500 |
2,400 |
3,400 |
| Cure |
60 minutes @ 150°C |
60 minutes @ 150°C |
15 minutes @ 150°C+ |
30 minutes @ 140°C |
15 minutes @ 150°C+ |
120 minutes @ 100°C |
| T(g)(%) |
155°C |
106°C |
160°C |
118°C |
>190°C |
110°C |
| Linear CTE |
TBD |
57x10-6 |
55x10-6 |
87x10-6 |
85x10-6 |
TBD |
| Volume Resistivity |
1.0x10-4 |
1.0x10-4 |
2.0x10-3 |
----- |
----- |
----- |
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| Applied by transfer or pick & place |
X |
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| Meets Mil Std. 883, Method 5011 |
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X |
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| High temperature |
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|
X |
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| Good chemical. heat, moisture resistance |
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|
X |
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| High flow, High T(g) |
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|
X |
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| Thin bond line |
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|
X |
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| Notes: |
1 |
2 |
3, 4 |
5 |
3 |
6 |
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---- Top ---- |
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| Notes: |
| 1. Silver filled, No degradation after solder reflow |
| 2. Excellent electrically conductive film, Mil Std. 883 |
| 3. High temperature applications |
| 4. High T(g), Low CTE, Chemical resistance |
| 5. Very high bond strength - most substrates |
| 6. Thin bond line applications (0.003 inches) |
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